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Samsung demonstrated LPDDR5X uMCP, which packaged 16GB memory and 1TB flash memory together;

Time:2022/12/01

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Samsung's UFS-based integrated multi-chip package is an award-winning embedded technology category that is currently used in a variety of high-end smartphones and electronics, as well as other industry-leading high-density, high-speed, low-power memory Applied to flagship products.

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